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Huawei unveils three-year AI chip roadmap

Huawei Technologies Co. Ltd. on Thursday unveiled an ambitious roadmap for new artificial intelligence hardware, challenging Nvidia Corp.’s dominance with a plan to launch four advanced chips by 2028 as the US firm faces mounting pressure in China, reports Caixin. At its annual All-Connect Conference, rotating chairman Xu Zhijun announced that Huawei will release the Ascend 950 PR chip in the first quarter of 2026, followed by the 950 DT in late 2026, the 960 in late 2027, and the 970 in late 2028.

“Compute power has been, and will remain, the core of AI—and for China, it is the most critical element,” Xu said. He vowed Huawei would double performance nearly every year to ensure domestic supply keeps pace with surging demand.

The roadmap signals progress in overcoming bottlenecks in local production capacity, which have constrained Chinese chipmakers since U.S. sanctions cut Huawei off from Taiwan Semiconductor Manufacturing Co. Ltd. in 2020. Huawei recently drew attention by equipping its foldable Mate XTs smartphone with a Kirin 9020 processor, the first high-end Kirin chip unveiled in four years.

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